Semiconductors
A six-record slice reaches from transistor capacitance to bonded dies, package heat paths and computing-in-memory clocking.
Semiconductors
One issued claim set places independently powered thermoelectric devices beneath separate circuitry blocks, while the wider cohort spans contacts, capacitors, glass-core substrates and memory modules.
Semiconductors
Intel's August 6 publication set concentrates on packaging, die-to-die interconnect and the arithmetic that runs on top of it. The distribution is the signal.
Semiconductors
A patent issued 28 July puts signal wiring on the backside alongside the power rails. It lands seven days after a closely related grant to the same assignee, and inside a 55-patent issue day.
Semiconductors
The eye-catching part of this filing is not the metrology. It is the independent claim covering the transfer of a bonding recipe from one tool to another — process knowledge moving across a fab as a claimed step.
Semiconductors
A published application covers attaching compound-semiconductor chips to wafers carrying waveguides or antennas. That join is where a silicon roadmap meets a materials base it does not own.
Semiconductors
A Micron application published July 16 is directed to updating per-row usage-based-disturbance counters in series, inside the refresh cycle time the system already concedes. The claims suggest reliability accounting is migrating onto the die and away from the host controller.
Semiconductors
A patent issued July 21 claims a device where at least 90% of frontside metal carries power and at least 90% of backside metal carries signal — the inverse of the backside power delivery approach the leading-edge roadmaps have adopted.
Semiconductors
A published application assigned to ASML NETHERLANDS B.V. claims a two-stage apparatus that parks donor dies in machined recesses, measures both the dies and the targets, and transfers a whole population in one stage move. The filing sits outside the scanner business the company is known for.
Semiconductors
US20260206566A1 describes an SRAM array split across two device layers — PFETs in the front-end-of-line, NFETs in the back-end-of-line. It is the only memory or transistor record in a drop otherwise given over to radios, antennas, and handsets.
Semiconductors
Among the TSMC applications published July 16, 2026, a cluster is directed at reaching a transistor's source/drain from the back of the wafer. One of them, US20260206554A1, addresses the thermal precondition the rest of the cluster takes for granted.
Semiconductors
A newly published application on double-liner through-glass vias lands the same week as a run of issued packaging patents, tracing a sustained push into glass-substrate advanced packaging.
Semiconductors
In this week's publication drop, Intel is the largest semiconductor assignee, and its filings concentrate almost entirely on gate-all-around transistors and backside power — the device layer, not the package. The cluster signals where the company is putting its disclosed R&D as it pushes its most advanced nodes and its foundry.
Semiconductors
An 8-K filed July 1, 2026 discloses that Belden Inc. completed its acquisition of the RUCKUS segment for approximately $1.87 billion in cash and entered a new $1,850.0 million senior secured term loan credit facility to fund the purchase price, fees, and expenses.
Semiconductors
An 8-K filed June 30, 2026 discloses that Lattice Semiconductor entered a Second Amended and Restated Credit Agreement with Wells Fargo providing a $200 million revolver and a $950 million delayed-draw term loan earmarked to fund its pending AMI acquisition — both undrawn at closing.
Semiconductors
An 8-K filed July 1, 2026 discloses that SiTime completed its acquisition of Renesas's timing business for roughly $1.5 billion in cash plus 3,558,691 shares, funded from cash on hand, and separately entered a $200 million Wells Fargo revolving credit facility that sat undrawn at closing.
Semiconductors
A tightly themed set of issued Intel grants in the June 30 drop covers glass-core substrates, on-glass interconnect bridges, hybrid-bonded passives, and coaxial through-glass vias — a portfolio signal that glass is the plane Intel is building future multi-die products on.
Semiconductors
An Item 2.02 8-K filed June 24, 2026 carries Micron's third-quarter results for the period ended May 28, 2026, with the company's own commentary tying the quarter to memory demand in the AI era and to multi-year Strategic Customer Agreements.
Semiconductors
Twin June 25 Form 8-Ks disclose an Agreement and Plan of Reorganization under which a wholly owned onsemi subsidiary merges into Synaptics. The filings fix a 1.350 exchange ratio, name mid-2027 as the target close, and set out matching $235M and $320M termination fees.
Semiconductors
More than thirty applications from the foundry published this week, and the cluster reads heavily toward backside power delivery and 3D/wafer-level packaging — the parts of the stack that gate advanced-node interconnect and AI-accelerator assembly.
Semiconductors
Cerebras Systems (CBRS) filed its first Item 2.02 earnings 8-K on June 23, 2026, disclosing $193.4 million in GAAP revenue, a 45% GAAP gross margin, and a $14.0 million GAAP net loss for the quarter ended March 31, 2026 — alongside a core (non-GAAP) operating loss of $3.5 million and full-year core revenue guidance of $855 million to $865 million.
Semiconductors
SEC filings tied to IQM Quantum Computers (via Real Asset Acquisition Corp.) and Pasqal (via Bleichroeder Acquisition Corp. II) both surfaced this week, documenting two European quantum hardware companies moving toward U.S. Nasdaq listings through SPAC mergers.
Semiconductors
The ultra-low-power AI-compute chip maker filed a follow-on registration statement on June 22, 2026, offering 1,800,000 shares of AMBQ common stock and disclosing an estimated $152.3 million in net proceeds at an assumed $90.48 price.
Semiconductors
Purchase-commitment disclosure shows the long-term foundry, packaging, and supply obligations a chip maker has agreed to pay. Item 303 governs it — and the balance can dwarf on-hand inventory.
